FEHONDA 18W/m.K LTP81 Thermal Putty for VGA GPU VARM PS4 PS5 High Thermal Conductive Gel for Heat Sink Cooling High Performance

Why Choose FEHONDA LTP81? It Solves Your Heat Troubles Directly!

This LTP81 thermal putty features an ultra-high thermal conductivity of 18W/m·K for fast heat dissipation, outperforming regular thermal pads. It is non-curing and flowable under pressure to sustain stable performance through repeated thermal cycles. As a flexible gap filler, it perfectly fills gaps from 0.2mm to 3.0mm to achieve full thermal contact between uneven components. Additionally, it provides reliable electrical insulation, wide temperature resistance from -40°C to 180°C and low component stress, making it perfect for GPU mods and replacing thermal pads between PCBs and coolers.

Tips:Thermal putty has a texture similar to modeling clay and is not as fluid as thermal paste. Therefore, it may be difficult to spread—this is normal. When using this product, we recommend wearing finger sleeves and pressing the paste onto the device with your fingers to ensure it adheres firmly.

FEHONDA LTP81 Thermal Putty Advantages

✅ 18W/m·K high thermal conductivity, faster heat dissipation than ordinary thermal pads, stable cooling for hot electronic chips
✅ Non-curing & flowable thermal gap filler, squeezes evenly under pressure like thermal grease, no hardening after long thermal cycles
✅ Perfect gap filling for 0.2mm–3.0mm height difference, fully fits uneven component surfaces to eliminate air gaps
✅ Safe electrical insulation, wide temp range -40℃~180℃, soft texture with low stress on fragile PCB & chips
✅ Long service life, no drying or cracking, ideal permanent replacement for traditional thermal pad

FEHONDA LTP81 Thermal Putty Wide Applications

1.PC hardware: GPU graphics card, VRAM memory, CPU, laptop motherboard, M.2 SSD, replace thermal pads between PCB and heat sink
2.Game console cooling modification: PS4, PS5, Xbox main chip & power module heat dissipation
Industrial electronics: Switch power supply, charger, server mainboard, drive board, BMS battery protection board
3.LED lighting: COB LED lamp beads, LED driver power thermal filling
4.New energy products: On-board power supply, photovoltaic inverter, lithium battery pack heat management
5.Overclock & hardware mod: All high-heat electronic components needing reliable thermal interface material